Generally, applying more pressure squeezes the TIM into the micro-cracks and crevaces of the h/s and IHS, providing a more even contact area. It also brings the heatsource much closer to the heat removal device "H/S". The Thermal Interface Material is just that, an interface, and doesn't do well with alot of TIM between the IHS and H/S so squeezing it thin with a tight mount does great things.
Cautionary statement is that you must have a solid backplate if you're gonna be wrenching down the h/s because you don't want the mobo to bend and crack traceroutes in the pcb. Another word of caution is that the pin's in the cpu socket can bend slightly if you have a mega tight mount, this will force you to always use a super tight mount or the processor won't contact the socket pins correctly during your next re-mount. I'm talking loads of torque here, not your vanilla boy's tight mount.
Also, make sure you are torquing down your mount equally, don't torque down on bolt at a time, use the old care rim bolt down theory and bolt down across rather than clockwise or other.
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