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-   -   New Heatsink Material [techPowerup] (http://www.overclockaholics.com/forums/showthread.php?t=300)

Kal-EL 04-06-2009 01:08 AM
New Heatsink Material [techPowerup]
 
New Heatsink Material - Copper-diamond Alloy
Researchers at Fraunhofer-Forscher have developed a new material which allows better cooling than the conventional copper and aluminum solutions. To achieve this result, diamond powder has been added to metallic copper. Diamond conducts heat five times better than copper.

The result is a bond with 1.5 times the heat conduction of copper. Another advantage is that the material does not expand too much when heated, otherwise it couldn't be used in electronic devices. » Read full story

clwoodwork 04-06-2009 01:11 PM
It seems to me IC Diamond beat them to the punch.:this: :rofl:rofl

Peace, Chuck

Kal-EL 04-06-2009 01:24 PM
Quote:
Originally Posted by clwoodwork (Post 1673)
It seems to me IC Diamond beat them to the punch.:this: :rofl:rofl

Peace, Chuck
I'm thinking Diamond laced LN2/DICE pots :D :D :D :D

Chuchnit 04-06-2009 01:39 PM
Quote:
Originally Posted by Kal-EL (Post 1674)
I'm thinking Diamond laced LN2/DICE pots :D :D :D :D
Now you are just dreaming :rolleyes:

DrNip 04-06-2009 04:54 PM
What's the cost ?

clwoodwork 04-06-2009 05:49 PM
Quote:
Originally Posted by DrNip (Post 1678)
What's the cost ?
Your marriage.:rofl:rofl:rofl:rofl:rofl

Peace, Chuck

Kal-EL 04-06-2009 06:09 PM
Quote:
Originally Posted by clwoodwork (Post 1679)
Your marriage.:rofl:rofl:rofl:rofl:rofl

Peace, Chuck
That it? Sign me up :trophy:


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