New Heatsink Material - Copper-diamond Alloy
Researchers at Fraunhofer-Forscher have developed a new material which allows better cooling than the conventional copper and aluminum solutions. To achieve this result, diamond powder has been added to metallic copper. Diamond conducts heat five times better than copper.
The result is a bond with 1.5 times the heat conduction of copper. Another advantage is that the material does not expand too much when heated, otherwise it couldn't be used in electronic devices.
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